Duiven, the Netherlands, June 10, 2009, BE Semiconductor Industries N.V. ("the Company" or "Besi") (Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of two important customer orders for wire bonding equipment by its Esec subsidiary.
Orders for an aggregate total of 104 latest and prior generation Esec wire bonders were received from two Asian assembly subcontractors for use in their Chinese manufacturing operations. The orders are scheduled for delivery in the second half of 2009. The purchase order amounts were not disclosed.
Richard Blickman, Chief Executive Officer of the Company, commented: "We are very pleased to receive these important orders from Esec customers after a competitive bidding process. We believe that such orders reflect the global competitiveness and high level market acceptance of the Esec wire bonding product portfolio and in particular, their high levels of flexibility, reliability, process technology and customer satisfaction at a very low cost of ownership."
About BE Semiconductor Industries N.V. BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, wire bonding, packaging and plating equipment for the semiconductor industry’s assembly operations. Its customers consist primarily of leading U.S., European and Asian semiconductor manufacturers, assembly subcontractors and industrial companies which utilize its products for both array connect and conventional leadframe manufacturing processes. For more information about Besi, please visit our website at www.besi.com

tijd 11.21 d.d. 10/6/09
Besi EUR 2,27 +30ct en 56.000 sts omzet.