ASM INTERNATIONAL REPORT FIRST QUARTER 2011 OPERATING RESULTS and ASM Achieves Two Wins for Plasma Enhanced ALD Memory Applications

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Beleggingsadvies 28/04/2011 06:55
ALMERE, THE NETHERLANDS, April 27, 2011 - ASM International N.V. (NASDAQ: ASMI and Euronext Amsterdam: ASM) reports today its first quarter 2011 operating results in accordance with US GAAP.
Highlights:
· Net sales for the first quarter 2011 were EUR 432 million, up 23% quarter-to-quarter and up 97% year on year. Excluding the acquired SEAS business, net sales decreased by 6% quarter-to -quarter. Net sales of our Front-end segment were up 17% quarter-to-quarter while comparable Back-end sales decreased by 15% mainly due to seasonality .
· Result from operations decreased from EUR 103 million in Q4, 2010 to EUR 94 million in Q1 2011. The first quarter of 2010 showed a profit of EUR 45 million;
° The Front-end segment increased from an operating profit of EUR 12.5 million (including EUR 1.8 million restructuring charges) to an operating profit of EUR 18.7 million quarter-to-quarter. Q1 2010 showed an operating loss of EUR 5.0 million including EUR 3.6 million restructuring charges;
° The Back-end segment operating profit decreased from EUR 90.0 million to EUR 75.0 million quarter-to-quarter and includes a profit of EUR 11.5 million as a result of the acquisition of the former Siemens SEAS business. Compared to the first quarter of 2010, the operating profit increased by EUR 25.3 million.
· First quarter 2011 net earnings were EUR 40 million compared to net earnings of EUR 25 million for the fourth quarter of 2010 and EUR 4 million for the first quarter of 2010. Excluding the revaluation of the conversion option, net earnings levelled at EUR 46 million in the fourth quarter 2010 and EUR 45 million in the first quarter 2011. As from Q2 2011 there will be no longer conversion option revaluation effects recognized through the income statement.
· Book to bill in the first quarter was 1.0, both in the Front-end and the Back-end segment. Including the acquired backlog of the former SEAS business (EUR 101 million) the backlog increased from EUR 500 million at the end of the fourth quarter 2010, to EUR 579 million at the end of the first quarter 2011.

Comment
Commenting on the results, Chuck del Prado, President and Chief Executive Officer of ASM International, said, "The first quarter of 2011 showed again strong results in the Front-end operations where we are now also reporting a positive cash flow from operations. The Front-end order book remains healthy, reflecting continued strong demand for ALD. Our Back-end segment showed the seasonal sales development. We noted an increase in incoming orders particularly towards the end of the quarter. The acquired SEAS business has already contributed this quarter to the bottom line ".

Outlook
Based upon the current backlog and our current visibility:

For our Front-end operations we expect a single digit growth in the second quarter of 2011 at constant FX-rates, compared to the first quarter of 2011. We expect lower bookings for Q2 than in Q1, 2011. Despite this we expect 2011 to become a strong growth year for our Front-end operations.
We expect for our Back-end operations a solid quarter given our strong backlog, assuming limited end-market demand disruption caused by the Japan earthquake.

About ASM International
ASM International N.V., headquartered in Almere, the Netherlands, and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI's website at www.asm.com


ASM Achieves Two Wins for Plasma Enhanced ALD Memory Applications

Secures High Volume Manufacturing Order and Qualifies New Process
ALMERE, The Netherlands, April 27, 2011 -ASM International N.V. (www.asm.com) (NASDAQ: ASMI and Euronext Amsterdam: ASM) today announced two wins for its plasma enhanced atomic layer deposition (PEALD) technology. First, ASM received multiple system orders for its plasma enhanced atomic layer deposition (PEALD) reactor from a leading memory customer in Asia. Second, the company qualified a new PEALD oxide application with a different memory manufacturer for the 2X nm node.

"Our innovative PEALD technology is seeing strong market validation with high volume business from multiple top tier memory customers," said Tominori Yoshida, general manager of ASM's Plasma Products business unit. "Alongside our growth in volume manufacturing, we continue to demonstrate technology leadership with our development efforts and expanding IP portfolio. Our increasing range of production-ready PEALD applications position us to support memory manufacturers now and as they move towards the challenging 1X nm node."

The PEALD systems were ordered by a leading memory customer for high volume manufacturing and will be installed in multiple facilities in Asia. The reactors will be used to deposit dielectrics for advanced lithography double patterning applications at the 3X nm technology node and below. This order represents the second major manufacturer to adopt ASM's PEALD system for use in double patterning in high volume manufacturing.

Further highlighting ASM's leadership in PEALD for memory devices, the company has also qualified a new oxide application for an advanced PEALD SiO layer that targets manufacturing at the 2X nm node and below. The new application is expected to enter volume production later this year with a different Asia-based manufacturer.

ASM's PEALD reactors are optimized to deposit dielectrics including SiO, SiN and SiCN. A major advantage of ASM's PEALD process is its ability to deliver conformal thin films at low temperatures, which is especially beneficial for double patterning lithography technologies where thin dielectrics are deposited over temperature sensitive photoresists for critical dimension control and pitch reduction.

Each of the systems ordered includes multiple PEALD reactors implemented on ASM's XP platform. The XP is a production-proven standard platform that can be configured with plasma enhanced chemical vapor deposition (PECVD), thermal ALD or PEALD reactors.






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